Circuit Board Manufacturing Attributes

Our circuit board manufacturing process adheres to the following attributes:

  • Max panel size – 21”x24”
  • Overall thickness – .015” -.125”
  • Maximum number of layers – 18
  • Copper weight – UL approved to 4oz. finish
  • Controlled impedance  – +/-5%
  • Panel separation either rout or score or combination of both
  • Standard and high Tg Fr4 laminates (RoHS compliant
  • High performance materials including Rogers 4003 and 4350