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Design For Manufacturing Requirements

Annular Ring

Standard

Internal Minimum Pad Size

.016” larger than finished hole size.

External Minimum Pad Size

.016” larger than finished hole size.

* increase pad size accordingly for annular
ring requirements greater than .001”.

* holes requiring greater than .001” copper
(i.e. 2oz. Base plated to 4oz. Finish) require
an additional .004” pad diameter

Plane Layer Clearance

PTH & NPT hole Clearance to Plane

.030” larger than finished hole size.

PTH & NPT hole to I/L Trace

.015” spacing

 

 

Line Width & Space

 

I/L Line Width on 1 oz. Base Copper or Less

.005” standard

I/L Line Width on 2 oz. Base Copper

.008” minimum

I/L Line Width on 3 oz. Base Copper or Greater

.012” minimum

O/L Line Width on 1 oz. Base Copper or Less

.005” standard

O/L Line Width on 2 oz. Base Copper

.008” minimum

O/L Line Width on 3 oz. Base Copper or Greater

.012” minimum

I/L Feature to Feature on 1 oz. Base Copper or Less

.005” standard

I/L Feature to Feature on 2 oz. Base Copper

.008” minimum

I/L Feature to Feature on 3 oz. Base Copper or Greater

.012” minimum

O/L Feature to Feature on 1 oz. Base Copper or Less

.005” standard

O/L Feature to Feature on 2 oz. Base Copper

.008” minimum

O/L Feature to Feature on 3 oz. Base Copper or Greater

.012” minimum

Trace to Plane Spacing on I/L or O/L

.008” minimum

Feature to Board Edge

.010” min I/L & O/L * exclude tabs

Feature to Score Edge

.020” minimum

 

 

Carbon Ink

 

Carbon Ink size to Copper Feature

.015” larger than feature size.

Carbon Ink to Carbon Ink Spacing

.015” minimum

Carbon Ink to Solder Mask

.005” minimum

 

 

Solder Mask

 

LPI Conductor Overlap

.003” min over conductor edge.

LPI Mask Clearance

.006” larger than O/L feature size.

LPI Mask Web* less than 4mil web may result in loss of mask between SMT pads.

.004” minimum width

 

 

Nomenclature

 

Silk Screen Process (legend ink)

.008” minimum aperture

Etching Process (copper)

.010” minimum aperture

Font Height

.065” minimum height

Distance from Feature (clipping)

.006” min from pad, SMT, etc.

   
 
 
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