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  • Capabilities
   
National Technology, Inc. can provide your surface finish of choice.
  • Electroless Nickel/Immersion gold (ENIG) Finish
    • Standard deposition of 3 – 5 micro inches Gold over 100 micro inches of Nickel
    • Best Lead Free choice for shelf life and solderability without “using a heat cycle” during board manufacturing.
  • Lead Free Hot Air Solder Level
    • SN100C Lead Free Solder Process
  • Conventional Hot Air Solder Level
    • * Not to be used on RoHS Compliant Product*
  • Immersion Silver
    • MacDermid Sterling Metallic Solderability Preservative.
  • OSP
    • Enthone CU 106

 
   
» Technical Product Capability
 
» PWB’s
» Materials
» Surface Finishes
» Solder Masks / Silk Screens
» Technology
» Process Capabilities
» Design for Manufacturability
» Equipment List
» PCB Process Flow Chart
 
» Generic PCB Process Flow Chart
» Multilayer/Buried &
Blind Via Process
Flow Chart
» Glossary & Acronyms
   
   
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