| F |
| FABRICATION DRAWING |
A drawing used to aid the construction of a printed wiring board. |
| FAST DEPOT |
FRU exchange, ECO upgrade, NTF , test, field ready pack out, advanced exchange, direct ship, FGI management. |
| FC |
Flip chip |
| FCIP |
Flip chip in package |
| FDR |
Frequency Domain Reflectometry |
| FET |
Field effect transistor |
| FHP |
Flying Head Probe |
| FINE PITCH |
Refers to chip packages with lead pitches below 1.27mm. |
| FINGER |
A gold-plated terminal of a card-edge connector. |
| FIRST ARTICLE |
A sample part or assembly manufactured prior to the start of production for the purpose of ensuring that the manufacturer is capable of manufacturing a product which will meet the requirements. |
| FIVE S |
Five Japanese-language terms used to create a workplace suited for visual control and Lean production. Seri means to separate needed tools, parts and instruction from unneeded materials and to remove the latter. Seiton means to neatly arrange and identify parts and tools for ease of use. Seiso means to conduct a cleanup campaign. Seiketsu means to conduct the first three S’s at frequent intervals to keep a workplace in perfect condition. Shitsuke means to form the habit of following the first four S’s. |
| FLASH MEMORY TECHNOLOGIES |
Non-volatile semiconductor ICs. They are derivatives of EPROM an EEPROM technologies. The architecture of flash chips is based on the idea that it will be seldom written to but will be read often. Rapidly replacing the other non-volatile memory types (ROM, EPROM & EEPROM) in many applications. |
| FLEXIBLE CIRCUIT ASSEMBLY |
Second-level integration of active and or passive devices on a flexible, formable substrate. |
| FLEXIBLE CIRCUITRY |
An array of conductors bonded to a thin, flexible dielectric. |
| FLIP-CHIP |
A mounting approach in which the chip is inverted and connected directly to the substrate rather than using the more common wire bonding technique. |
| FLUX |
A substance used to promote or facilitate fusion such as a material used to remove oxides from surfaces to be joined by soldering or welding. |
| FO |
Fiber optic |
| FOOTPRINT |
The pattern and space on a board taken up by a component. |
| FPC |
Flexible Printed Circuit |
| FPD |
Flat Panel Display |
| FR-1 |
A lower grade version of FR-2 |
| FR-2 |
A NEMA grade of Flame-Retardant industrial laminate having a substrate of paper and resin binder of phenolic. |
| FR-4 |
A NEMA grade of Flame-Retardant industrial laminate having a substrate of woven-glass fabric and resin binder of epoxy |
| FR-6 |
Fire-Retardant glass-and-polyester substrate material for electronic circuits. |
| FTIR |
Fourier transform infrared spectroscopy |
| FULFILLMENT |
A process that supplies a finished manufactured product directly from a manufacturing facility to a distributor or end user without the finished product going back through the company that has created the product. The fulfillment cycle may include receiving customer orders, configuring the products to order, shipping and invoicing products to distribution outlets or end users around the world. |
