| P |
| PAD |
The portion of the conductive pattern on printed circuit boards designated for the mounting or attachment of components. Also called ‘land’. |
| PANEL |
The copper foil laminated fiberglass panel that printed circuit boards are built upon. Also known as substrate interlayer or core. |
| PARTS MANAGEMENT |
Serial number tracking, EC management, parts exchange, configuration management, FGI levels, secondary channel sales, parts sale/restocking, advanced sales, sub-contract repair management. |
| PASSIVE COMPONENT |
A device which does not add energy to the signal it passes, e.g., resistros, capacitors, and inductors. |
| PBGA |
Plastic ball grid array |
| PC CARDS |
Personal Computer: A computer device packaged in a small card about the size of a credit card and conforming to the PCMCIA standard. |
| PCB |
Printed circuit board. A flat plate or base of insulation material containing a pattern of conduction material. |
| PCB’s |
Poly Chlorinated Biphenyl compounds |
| PCI |
Peripheral Component Interconnect: a local bus standard developed by Intel Corporation. Most modern PCs include a PCI bus in addition to a more general ISA expansion bus. Many analysts, however, believe that PCI will eventually supplant ISA entirely. |
| PCM |
Pulse code Modulation: a sampling technique for digitizing analog signals, especially audio signals. PCM is used with T-1 and T-3 carrier systems. These carrier systems combine the PCM signal from many lines and transmit them over a single cable or other medium. |
| PCMCIA |
Personal Computer Memory Card International Association. |
| PDA |
Personal digital assistant |
| PEEL STRENGTH |
A test performed to determine the adhesion strength of bonded materials to the printed circuit board. |
| PGA |
Pin grid array |
| PI |
Polyimide |
| PIN |
A terminal on a through-hole component. |
| PINHOLE |
A minute hole through a layer or pattern. |
| PINK RING |
The dissolution of oxide near a drilled hole causing a “pinkish” discoloration of the copper. |
| PIN-THROUGH-HOLE (PTH) |
A method of soldering electrical components to a board substrate that involves pin-through-hole connections. |
| PITCH |
The nominal distance between the centers of adjacent features or traces on any layer of a printed circuit board. Also referred to as ‘center-to-center spacing’. |
| PLATING RESISTS |
Material over conductive areas used to prevent the plating of the covered areas. |
| PLCC |
Plastic Leaded Chip Carrier. An SMT chip package that is rectangular or square-shaped with leads on all four sides. |
| PNB |
Normalized bumping performance |
| POKA YOKE |
A mistake-proofing device or procedure to prevent a defect during order taking or manufacturing. |
| POLYMERIZE |
To unite chemically two or more monomers or polymers to form a molecule with a higher molecular weight. |
| PQFP |
Plastic Quad Flat Pack |
| PREPREG |
A fiberglass cloth impregnated with resin used in multilayer lamination. Also known as B-Stage Material. |
| PRINTED CIRCUIT |
A circuit for electronic apparatus made by depositing conductive material in continuous paths from terminal to terminal on an insulating surface. |
| PRINTED CIRCUIT BOARD LAYOUT |
The process of transforming the electrical design (functional or logical representation) into a physical object (physical layout of placing components and routing of interconnect wires). |
| PRINTER CIRCUIT BOARD ASSEMBLY |
Second-level integration of active and passive devices (electrical, electronic, optical and/or mechanical) on a rigid substrate. |
| PROCESS DEVELOPMENT |
Tailoring or building manufacturing methods for technology mix elected by customer. |
| PTH |
Plated-through-hole. A hole in a PWB with the metal plating added after it is drilled. |
| PULL SYSTEM |
A system that eliminates the primary source of waste-overproduction-by producing only what customers want, when they want it. This means starting production only when the customer pulls. |
| PWA |
Printed wiring assembly. |
| PWB |
Printed wiring board. |
| PWBA |
Printed Wiring Board Assembly. |
