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| WEEE |
Waste Electronics and Electrical Equipment |
| WIP |
Work in process. |
| WIRE BONDING |
The method used to attach very fine wire to semiconductor components to interconnect these components with each other or with package leads. The wires might be 1 to 2 mils in diameter and made fo aluminum containing 1% silicon. |
| WL-CSP |
Wafer-level chip-scale package |
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