Process Capabilities

We strive for seamlessness in our two printed circuit board manufacturing facilities, but there are some distinctions in process capability between our Rolling Meadows facility and our India facility:

National Technology, Inc
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Sonic Tech. (India), Inc.
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Space 57,000 Square Feet 100,000 Square Feet
Inner Layer
Trace/Space
.004″/.004″ .005/”.005″
Outer Layer
Trace/Space
.004″/.004″ .005″/.005″
Minimum Drilled Hole .010″ .010″
Number of Layers 2-18 Layers 1-10 Layers
Minimum SMT Pitch .016″ .020″
Layer to Layer
Registration
+/-.005″ +/-.005″
Soldermask
Registration
LPI +/-.0025″ LPI +/-.0025″
Feature to Feature
Registration
+/-.003″ +/-.003″
Maximum Finished
Board Thickness
.125″ .125″
Board Thickness
Tolerance
+/-.005″ (.062) +/-.007 (.062)
Board Flatness
Tolerance
.007 (in./in.) .007 (in./in.)
ENiG Capability Yes Yes
Immersion Silver
Capability
Yes Yes
Electrical
Test Capability
Net List/Clam Shell/MPT/Grid Net List/Clam Shell/MPT/Grid
Laser Photo Plotting In House In House
AOI Capability Inner layer (I/L) Inner layer (I/L)
Controlled Impedance Yes N/A
Blind/Buried Via’s Blind/Buried N/A
UL Line Approval .004″ Line/Space .004″ Line/Space
Military Approval N/A N/A
ISO Certified Yes; ISO-9001-2008 Yes; ISO-9001-2008