Technical Capabilities

United States Facility

United States- Printed Circuit Board Manufacturing Capabilities


 

National Technology, Inc
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Space 57,000 Square Feet
Inner Layer
Trace/Space
.004″/.004″
Outer Layer
Trace/Space
.004″/.004″
Minimum Drilled Hole .010″
Number of Layers 2-18 Layers
Minimum SMT Pitch .016″
Layer to Layer
Registration
+/-.005″
Soldermask
Registration
LPI +/-.0025″
Feature to Feature
Registration
+/-.003″
Maximum Finished
Board Thickness
.125″
Board Thickness
Tolerance
+/-.005″ (.062)
Board Flatness
Tolerance
.007 (in./in.)
ENiG Capability Yes
Immersion Silver
Capability
Yes
Electrical
Test Capability
Net List/Clam Shell/MPT/Grid
Laser Photo Plotting In House
AOI Capability Inner layer (I/L)
Controlled Impedance Yes
Blind/Buried Via’s Blind/Buried
UL Line Approval .004″ Line/Space
Military Approval N/A
ISO Certified Yes; ISO-9001-2008